Abstract:
This study investigates the influence of using micro-encapsulated phase change material (MEPCM) on the thermal and hydraulic performance of micro-channel heat sinks used for heat dissipation of high power electronic devices. A three-dimensional, one-phase, laminar flow model of a rectangular channel using water slurry of MEPCM with temperature dependent physical properties was developed. The results showed a significant increase in the heat transfer coefficient under certain conditions for heat flux rates of 100 W/cm2 and 500 W/cm2 that is mainly dependant on the channel inlet and outlet temperatures and the selected MEPCM melting temperature. Lower and more uniform temperatures across the electronic device can be achieved at less pumping power compared to using water only as the cooling fluid.
