Computed Tomography Scanning for Quantifying Chipseal Material Volumetrics

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dc.contributor.author Kodippily, Sachi en
dc.contributor.author Henning, Theunis en
dc.contributor.author Ingham, Jason en
dc.contributor.author Holleran, G en
dc.date.accessioned 2015-06-03T05:30:02Z en
dc.date.issued 2014-05 en
dc.identifier.citation Journal of Computing in Civil Engineering, 2014, 28 (3), pp. 04014002 - 04014002 en
dc.identifier.issn 0887-3801 en
dc.identifier.uri http://hdl.handle.net/2292/25731 en
dc.description.abstract In the reported study the viability of using computed tomography (CT) scanning for assessing flushing defects in thin sprayed seal (chipseal) surfacings was explored. The study was undertaken to investigate the micromechanical interactions that occur within chipseal layer materials in order to examine their relationship to the origination of flushing, using CT scanning techniques. In particular, the effectiveness of using image analysis techniques to analyze the changes in air voids that occur within a chipseal layer during loading was investigated. The presented study was based on laboratory testing of chipseal pavement samples (cores) from in-service pavements in the Auckland and Waikato regions of New Zealand. The cores, with diameters of 200 mm and thicknesses ranging from 32.4 mm to 44.5 mm, were subjected to varying levels of lateral cyclic loading using a wheel-tracking machine, and the deformation that occurred on the surface of the cores was measured. Two small specimens were extracted from each loaded core, one specimen from the wheel-tracked area of the core and the other from the untracked area of the core. The specimens were scanned using a CT scanner, and the resulting scan images were analyzed using image analysis techniques to determine the distribution of air voids within each specimen. The air voids within the tracked and untracked specimens of each core were compared to examine the changes that had occurred to the distribution of air voids during loading. The results of the study showed that image analysis is an effective tool to analyze air voids within a chipseal layer. en
dc.publisher American Society of Civil Engineers (ASCE) en
dc.relation.ispartofseries Journal of Computing in Civil Engineering en
dc.rights Items in ResearchSpace are protected by copyright, with all rights reserved, unless otherwise indicated. Previously published items are made available in accordance with the copyright policy of the publisher. Details obtained from http://www.sherpa.ac.uk/romeo/issn/0887-3801/ en
dc.rights.uri https://researchspace.auckland.ac.nz/docs/uoa-docs/rights.htm en
dc.title Computed Tomography Scanning for Quantifying Chipseal Material Volumetrics en
dc.type Journal Article en
dc.identifier.doi 10.1061/(ASCE)CP.1943-5487.0000284 en
pubs.issue 3 en
pubs.begin-page 04014002 en
pubs.volume 28 en
dc.rights.holder Copyright: American Society of Civil Engineers (ASCE) en
pubs.end-page 04014002 en
dc.rights.accessrights http://purl.org/eprint/accessRights/RestrictedAccess en
pubs.subtype Article en
pubs.elements-id 447275 en
pubs.org-id Engineering en
pubs.org-id Civil and Environmental Eng en
dc.identifier.eissn 1943-5487 en
pubs.record-created-at-source-date 2015-06-03 en


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