Kenaf MDF panels: A statistical approach in parameter selection

Abstract

The aim of this study was to determine the practicality of using conductive fillers in medium density fibreboard panels to enable uniform electrical conductivity in the panels to achieve uniform surface coating during powder coating. A relatively new concept of adding carbon black has been tried, triacetin has been used as a compatibliser to retain/improve the fibre–matrix interfacial bonding in the presence of the filler, and a soy based bioresin has been used as an alternative to conventional urea-formaldehyde resin system. As the properties of such composite systems depend on the proportion of their constituents, a statistical analysis based on Taguchi method has been used to study the complex multivariable system. A two-level, three-factor L8 orthogonal array was used to carry out a full factorial analysis to determine the effect each factor had on various panel properties. The key properties investigated in this report are: panel thickness, electrical conductivity, internal bond strength, modulus of rupture and modulus of elasticity. It was found that a mixture of 7% resin, 1% triacetin and 5% carbon black produced a panel with sufficient mechanical and conductive properties to be a viable alternative. The addition of carbon black showed up to 75% improvement in conductivity, with the Soyad adhesive system showing significant improvements in conductivity over the UF adhesive system itself.