Micro electronic systems via multifunctional additive manufacturing

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dc.contributor.author Li, J en
dc.contributor.author Wasley, T en
dc.contributor.author Ta, D en
dc.contributor.author Shephard, J en
dc.contributor.author Stringer, Jonathan en
dc.contributor.author Smith, PJ en
dc.contributor.author Esenturk, E en
dc.contributor.author Connaughton, C en
dc.contributor.author Harris, R en
dc.contributor.author Kay, R en
dc.date.accessioned 2020-01-13T01:55:24Z en
dc.date.issued 2018-04-16 en
dc.identifier.issn 1355-2546 en
dc.identifier.uri http://hdl.handle.net/2292/49668 en
dc.description.abstract Purpose This paper aims to demonstrate the improved functionality of additive manufacturing technology provided by combining multiple processes for the fabrication of packaged electronics. Design/methodology/approach This research is focused on the improvement in resolution of conductor deposition methods through experimentation with build parameters. Material dispensing with two different low temperature curing isotropic conductive adhesive materials was characterised for their application in printing each of three different conductor designs, traces, z-axis connections and fine pitch flip chip interconnects. Once optimised, demonstrator size can be minimised within the limitations of the chosen processes and materials. Findings The proposed method of printing z-axis through layer connections was successful with pillars 2 mm in height and 550 µm in width produced. Dispensing characterisation also resulted in tracks 134 µm in width and 38 µm in height allowing surface mount assembly of 0603 components and thin-shrink small outline packaged integrated circuits. Small 149-µm flip chip interconnects deposited at a 457-µm pitch have also been used for packaging silicon bare die. Originality/value This paper presents an improved multifunctional additive manufacturing method to produce fully packaged multilayer electronic systems. It discusses the development of new 3D printed, through layer z-axis connections and the use of a single electrically conductive adhesive material to produce all conductors. This facilitates the surface mount assembly of components directly onto these conductors before stereolithography is used to fully package multiple layers of circuitry in a photopolymer. en
dc.publisher Emerald en
dc.relation.ispartofseries Rapid Prototyping Journal en
dc.rights Items in ResearchSpace are protected by copyright, with all rights reserved, unless otherwise indicated. Previously published items are made available in accordance with the copyright policy of the publisher. en
dc.rights.uri https://researchspace.auckland.ac.nz/docs/uoa-docs/rights.htm en
dc.title Micro electronic systems via multifunctional additive manufacturing en
dc.type Journal Article en
dc.identifier.doi 10.1108/RPJ-02-2017-0033 en
pubs.issue 4 en
pubs.begin-page 752 en
pubs.volume 24 en
dc.rights.holder Copyright: The author en
pubs.end-page 763 en
dc.rights.accessrights http://purl.org/eprint/accessRights/RestrictedAccess en
pubs.subtype Article en
pubs.elements-id 736877 en
pubs.org-id Engineering en
pubs.org-id Mechanical Engineering en
pubs.record-created-at-source-date 2018-04-17 en

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